2.8 inch OLED Display Module 256x64 Resolution Parallel/SPI
Interface
This high-performance 2.8-inch OLED display module features a
256(H)×64(V) resolution and offers versatile interface
compatibility, including 68XX/80XX Parallel MPU, 3-Wire SPI, and
4-Wire SPI. Equipped with a monochrome green display, passive
matrix technology, an ultra-high contrast ratio of >2000:1, and
a 160° wide viewing angle, it delivers sharp, clear image quality.
With a broad operating temperature range of -30℃ to 85℃ and a long
service life of 10,000 hours, it’s perfectly suited for industrial
control systems, portable instruments, embedded systems, IoT
devices, and professional equipment.
| Product | 2.8 inch OLED Module | Active Area | 69.104(W)×17.264(H) mm |
|---|
| Resolution | 256(H)×64(V) dots | Display Color | Green (Monochrome) |
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| Brightness | 60 Cd/m² (Min.), 80 Cd/m² (Typ.) | Outline Dimensions (Panel) | 84.00(W)×25.80(H)×2.00(T) mm |
|---|
| Viewing Angle | ≥160 Degree | Display Supply Voltage (VCC)
| 11.5 ~ 12.5 V (Typ. 12 V) |
|---|
| Interface | Parallel (68XX/80XX MPU) / Serial (3-Wire SPI / 4-Wire SPI) | Operating Temperature | -30 ~ +85 ℃ |
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| Driver IC | SSD1322 | Storage Temperature | -40 ~ +90 ℃ |
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| IC Package Type | COF (Chip on Film) | Duty | 1/64 |
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| Pixel Pitch | 0.27(W)×0.27(H) mm | Display Mode | Passive Matrix |
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| Pixel Size | 0.254(W)×0.254(H) mm | Weight | 8.8 g |
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| Contrast Ratio | >2000:1 (Darkroom) | Operating Life Time | 10,000 Hours (@80 Cd/m², 50% Checkerboard) |
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| Operation Supply Voltage (VCI) | 2.4 ~ 3.5 V (Typ. 2.8 V) | Logic Supply Voltage (VDD) | 2.4 ~ 2.6 V (Typ. 2.5 V) |
|---|
Product Highlights: 2.8-inch OEL display, 256×64 resolution, multi-interface support
(Parallel/SPI), SSD1322 driver IC, COF packaging, monochrome green
display, >2000:1 high contrast ratio, 160° wide viewing angle,
industrial-grade temperature range (-30~85℃), compact design, low
power consumption, long service life, reliable performance for
harsh environments
Technical Features
- COF (Chip on Film) packaging ensures compact size (84.0×25.8×2.0mm)
and high mechanical reliability, suitable for space-constrained
applications
- Multi-interface compatibility (68XX/80XX parallel, 3-wire SPI,
4-wire SPI) enables flexible integration with various MCUs and
processors
- Excellent optical performance: >2000:1 darkroom contrast ratio,
80 Cd/m² typical brightness, and 160° wide viewing angle for
consistent display from all directions
- Industrial-grade temperature range (-30℃ to +85℃) ensures stable
operation in harsh environments such as industrial sites and
outdoor equipment
- Low power consumption: Typical VCI operating current 1.8mA, VCC
operating current 25.5mA (50% display area on), sleep mode current
≤5μA
- Rigorous reliability tests: Passes 500-hour high/low temperature
operation/storage, high temperature/humidity storage, and thermal
shock tests (-40℃⇔85℃, 100 cycles)
- Brightness adjustment via IREF pin allows customization of display
effects to adapt to different application scenarios
- Compliant with MIL-STD-105E sampling plan, with strict quality
control standards (AQL 0.65 for major defects, 1.0 for minor
defects)
- Built-in noise suppression and ESD protection, ensuring stable
operation in complex electromagnetic environments
Electrical Specifications
High Level Input (VIH): ≥0.8×VDDIO; Low Level Input (VIL):
≤0.2×VDDIO
High Level Output (VOH): ≥0.9×VDDIO (@Iout=100μA, 3.3MHz); Low
Level Output (VOL): ≤0.1×VDDIO (@Iout=100μA, 3.3MHz)
Operating Current: VCI (1.8~2.25mA Typ.), VCC (25.5~31.9mA Typ.
@50% display area on; 40.1~51.1mA @100% display area on)
Sleep Mode Current (VCI/VCC): ≤5μA
SPI Interface Timing: Minimum clock cycle 100ns, clock high/low
time ≥20ns
Parallel Interface Timing: Minimum clock cycle 300ns, access time
≤140ns
Pin Definition
| PIN | Symbol | Description |
|---|
| 1 | N.C. (GND) | Reserved Supporting Pin; Must be connected to external ground to
reduce stress influence on function pins |
| 26 | VCI | Power Supply for Operation; Must be connected to external source,
always equal to or higher than VDD & VDDIO |
| 25 | VDD | Power Supply for Core Logic Circuit; Can be supplied externally
(2.4~2.6V) or regulated internally from VCI; Connect capacitor to
VSS |
| 24 | VDDIO | Power Supply for I/O Pin; Connect to VDD or external source; All
I/O signals have VIH reference to VDDIO |
| 2 | VSS | Ground of Logic Circuit; Reference for logic pins; Must be
connected to external ground |
| 3,29 | VCC | Power Supply for OEL Panel; Most positive voltage supply pin; Must
be connected to external source |
| 5,28 | VLSS | Ground of Analog Circuit; Should be connected to VSS externally |
| 22 | IREF | Current Reference for Brightness Adjustment; Connect to VSS via
resistor; Set current lower than 10μA |
| 4 | VCOMH | Voltage Output High Level for COM Signal; Connect tantalum
capacitor to VSS |
| 27 | VSL | Voltage Output Low Level for SEG Signal; Leave open if external VSL
not used; Connect resistor and diode to ground if used |
| 21 | FR | Cascade Application Connection Pin; No Connection pin; Must be left
open individually |
| 6~13 | D7~D0 | Host Data Input/Output Bus; 8-bit bi-directional data bus; Serial
mode: D1=SDIN, D0=SCLK; Unused pins connect to VSS |
| 14 | E/RD# | Read/Write Enable or Read; 68XX-series: Enable (E) signal;
80XX-series: Read (RD#) signal; Connect to VSS in serial mode |
| 15 | R/W# | Read/Write Select or Write; 68XX-series: Read/Write selection;
80XX-series: Write (WR#) input; Connect to VSS in serial mode |
| 16 | BS0 | Communicating Protocol Select; MCU interface selection input (works
with BS1) |
| 17 | BS1 | Communicating Protocol Select; 3-wire SPI (BS0=1, BS1=0); 8-bit
80XX Parallel (BS0=0, BS1=1) |
| 18 | D/C# | Data/Command Control; High = input as display data; Low = input
transferred to command register |
| 19 | CS# | Chip Select; Chip enabled for MCU communication only when pulled
low |
| 20 | RES# | Power Reset for Controller and Driver; Chip initialization executed
when pin is low |
| 23 | N.C. | Reserved Pin; Reserved for compatible and flexible design |
| 30 | N.C. (GND) | Reserved Supporting Pin; Must be connected to external ground to
reduce stress influence on function pins |
Application Scenarios
- Industrial control equipment (PLC panels, sensor data monitors,
industrial controllers, industrial meters)
- Portable instruments (handheld meters, data loggers, portable
detection devices)
- Embedded systems (IoT terminals, smart controllers,
microcontroller-based projects)
- Consumer electronics (smart home controllers, small POS machines,
electronic appliances)
- Automotive electronics (in-vehicle monitoring displays, small
control screens, diagnostic tools)
- Medical devices (portable medical monitors, small diagnostic
equipment, healthcare devices)
- Professional equipment (test instruments, measuring tools,
communication devices)
Customization Options
- FPC Design: Flexible FPC length and pin layout adjustments to match system
integration requirements
- Brightness Tuning: Customizable brightness levels (60~100 Cd/m²) based on specific
application needs
- Interface Optimization: Interface customization and initialization code adaptation for
specific MCUs
- Polarizer Customization: Different polarizer types (wide view, high contrast) for special
viewing requirements
- Packaging Solution: Custom anti-static packaging, vacuum packaging with desiccant for
long-term storage
- Quality Inspection: Enhanced quality control standards and custom inspection items for
bulk orders
- Warranty Extension: Extended warranty options (18~24 months) for bulk orders
Handling Notes
1. Electrostatic Protection: Use anti-static bracelets and grounded
tools when handling. Work in 50%-60% relative humidity environment
to reduce static generation. Do not touch pins, electrodes, FPC
patterns or IC directly with hands. Shield the OEL driver from
light in product design to avoid malfunction.
2. Cleaning Instructions: The polarizer surface is soft and easily
scratched. Clean with Scotch Mending Tape No. 810 or equivalent. Do
not use water, ethyl alcohol, ketone or aromatic solvents as they
may damage the polarizer. Wipe off residue adhesive with
recommended tape if needed.
3. Soldering Requirements: Avoid applying stress to LSI chips and
surrounding molded sections. Ensure proper grounding of soldering
tools. Do not overheat pins during soldering.
4. Storage Conditions: Store in anti-static vacuum bags avoiding
direct sunlight, fluorescent light, high temperature/humidity or
low temperature (＜0℃) environments. Recommended storage
temperature: 0℃~30℃, humidity ≤60%. Prevent dewing on packages.
Reseal if not used within 1 month after opening.
5. Operation Precautions: Follow the correct power-on sequence (VCI
& VDDIO → Display off command → Initialization → Clear Screen → VCC
→ Delay 100ms → Display on command) and power-off sequence (Display
off command → VCC off → Delay 100ms → VCI & VDDIO off). Do not
apply input signals when logic power is off. Avoid fixed pattern
display for long periods to prevent afterimages. Install
overcurrent protection (0.5A fuse recommended) in the VDD power
circuit.
6. Disposal Notes: Request qualified companies to handle industrial
wastes when disposing of the module. Observe environmental and
hygienic laws and regulations if burning is necessary.
